Narrow Your Search
Product Type
Polishing Slurries
Product Type
Conditioners (4)
Edge Grinding (2)
Grinding and Slicing (12)
ID Slicing Blades (2)
Lapping Additives (8)
Molded Products (7)
Polishing Fixtures (12)
Polishing Pads (40)
Polishing Slurries (137)
Rinsing and Cleaning (2)
Sonic Cleaning (13)
Wafering Adhesives (7)
Company Brands
Dow®
Eminess™
Intersurface Dynamics
Nalco™
SMI
Valtech
Base Materials
Aluminum Oxide
Cerium Oxide
Colloidal Silica
Diamond
Epoxy
Felt
Fiberglass
Multiparticle Blend
Polymer
Poromeric
Silicon Carbide
Stainless Steel
Urethane
Water
Zirconium
Applications
Acryllic (1)
Aluminosilicate (2)
Aluminum (12)
Aluminum Nitride (1)
APEX (2)
Berylium (13)
BK7 (2)
BK9 (2)
Borofloat (2)
Borosilicate (2)
Cadmium Zinc Telluride (12)
Calcium Fluoride (13)
Ceramic (54)
Cleartran - Zn Su Multi-spectral (1)
Copper CMP (1)
Crystal Quartz (2)
Fused (1)
Fused Silica (42)
Gallium Antimonide (1)
Gallium Arsenide (36)
Gallium Nitride (2)
Germanium (33)
Glass (55)
Gorrilla (2)
Indium Phosphide (18)
Leaded Crystal (2)
Lithium Niobate (15)
Lithium Tantalate (14)
Mercury Cadmium Telluride (1)
Nickel (15)
Phosphate (2)
Poly Carbonate lens (13)
Polysilicon (11)
Pyrex (2)
Quartz (1)
Sapphire (58)
SF6 Flint (2)
Silicon (41)
Silicon Carbide (54)
Soda Lime - Float (2)
Spinel (4)
Stainless Steel (14)
TEOS (1)
Tungsten (10)
Zerodur (17)
Zinc (1)
Zinc Borosilicate (2)
Zinc Selenide (14)
Zinc Sulfide (1)
Product Brands
Acuplane™
Celexis™
Challenge
IC1000™
Kinik®
Klebosol™
Nanopure™
Politex™
Suba™
Tensor
Ultra-Sol®
Valtron®
Vector
Dow ACuPLANE LK393c4
Copper Barrier Slurry
The LK393c4 Copper Barrier slurry, the latest addition to the LK Series, is an alkaline mixture of ultra-pure water, colloidal silica, and proprietary additives that enable its robust process performance. With a 1:1 selectivity of...
| Base Material | Particle Size (um) | pH | Solids Content |
| Colloidal Silica | 0.050 | 10.4 | 12 |
Dow® CUS1351
Copper Barrier Slurry
The CUS1351 barrier slurry for copper CMP was designed to improve upon the dishing and erosion results obtained after first step polishing while removing any residual copper present after the first step polishing process. CUS1351...
| Base Material | pH | Solids Content |
| Colloidal Silica | 8.9 | 12.4% |
Dow® Klebosol™ 1501-50
Industry standard CMP colloidal silica for ILD and STI
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.050 | 10.9 | 30.0% | 1.21 |
Dow® Klebosol™ 1508-50
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.050 | 10.9 | 30.0% | 1.21 |
Dow® Klebosol™ 1630/16
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.120 | 10.7 | 16.0% | 1.21 |
Dow® Klebosol™ 1630/26
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.120 | 10.7 | 26.0% | 1.21 |
Dow® Klebosol™ 30H50
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
Applications: Tungsten
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.050 | 2.0 | 30.0% | 1.21 |
Dow® Klebosol™ 30N50
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.050 | 10.0 | 30.0% | 1.21 |
Dow® Klebosol™ 30N50PHN
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.050 | 10.9 | 30.0% | 1.21 |
Dow® Klebosol™ 40PA50
Industry Standard Colloidal Silica Slurries for CMP
Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed...
| Base Material | Particle Size (um) | Specific Gravity |
| Colloidal Silica | 0.050 | 1.30 |
Nalco™ 2329
Colloidal Silica Dioxide
NALCO 2329is a colloidal dispersion of submicron-sized silica particles in the form of tiny spheres, in an alkaline aqueous solution. NALCO 2329has a negative surface charge and is ammonium stabilized. Primary Benefits High silica concentrationOptical clarity Primary Applications Binder...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.075 | 8.4 | 40.0% | 1.29 |
Nalco™ 2350
Standard Colloidal Silica
Nalco's benchmark stock polishing slurry, the2350 is a colloidal silicaspecifically formulated for applications where a balance of removal rate and surface quality is desired.Nalco 2350 is one of the most widely used silicon polishing slurries...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.060 | 11.0 | 50.0% | 1.39 |
Nalco™ 2354
Standard Colloidal Silica
Nalco 2354 is a colloidal silica polishing slurry specifically formulated for extended pad life through minimization of pad glazing.Nalco 2354 features a 15-20% higher removal rate than Nalco 2350, at the cost of rougher surface...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.060 | 12.0 | 46.0% | 1.35 |
Nalco™ 2358
Colloidal Silica for Stock Removal on Silicon
Nalco 2358 is a colloidal silica polishing slurry specifically formulated as a next generation replacement to the Nalco 2350. It contains lower metals than 2350, and typically yields a 10-15% higher removal rate.This is espcially...
Applications: Silicon
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.070 | 12.0 | 28.0% | 1.19 |
Nalco™ 2360
Colloidal Silica for Final Finish on Silicon
Nalco 2360 is a standard colloidal silica slurry originally designed for final polish of silicon. It features a proprietary blend of three custom particle sizes,high concentration, anda low cost of ownership.
Applications: Silicon
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.060 | 8.5 | 50.0% | 1.39 |
Nalco™ 2371
Standard Colloidal Silica
Nalco 2371 is a colloidal silica polishing slurry specifically designed to meet the requirements of recirculated stock removal systems and low sodium levels. The level of sodium ion impurities in this slurry has been minimized...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.070 | 11.8 | 28.0% | 1.19 |
Nalco™ 2398
Colloidal Silica for Stock Removal on Silicon
Nalco 2398 is a colloidal silica polishing slurryspecifically designed to lower the residual metals levels on wafers after the stock polishing process. The chemical additive package specifically targets copper ions to prevent their transfer into...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.085 | 11.8 | 28.0% | 1.19 |
NanoArc® CE-6450
High Purity Nanoparticle Ceria Slurry
Designed to meet the demanding requirements of Chemical Mechanical Planarization and other Precision Polishing applications, Nanophase nano-ceria materials combine a fully designed structure with high purity. NanoArc CE-6450 is designed for super polish applications where...
Applications: Fused Silica, Glass
| Base Material | Particle Size (um) | pH | Solids Content |
| Cerium Oxide | 0.030 | 8.0 | 18% |
NP1000
Nanopure Stock Polishing Slurry
The NP 1000 series final polishing slurries are high purity products designed for the demanding requirements of final polishing of silicon wafers. These slurries have been formulated using the cleanest colloidal silica available along with...
Applications: Silicon
| Base Material |
| Colloidal Silica |
NP8020
Nanopure Final Polishing Slurry
The NP 8000 series final polishing slurries are high purity products designed for the demanding requirements of final polishing of silicon wafers. These slurries have been formulated using the cleanest colloidal silica available along with...
Applications: Silicon
| Base Material | Particle Size (um) | pH | Solids Content |
| Colloidal Silica | 0.070 | 10.5 | 10.0% |
NP8040
Nanopure Final Polishing Slurry
The NP 8000 series final polishing slurries are high purity products designed for the demanding requirements of final polishing of silicon wafers. These slurries have been formulated using the cleanest colloidal silica available along with...
Applications: Silicon
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Colloidal Silica | 0.070 | 10.5 | 4.5% | 1.02 |
Ultra-Sol® 1000
Cerium Oxide Polishing Slurry
Ultra-Sol 1000 is an exceptionally uniform cerium oxide dispersion used extensively for general purpose polishing of glass, quartz, fused silica, and other silica-based optical materials. The alkaline (pH 9) slurry is formulated to provide...
Applications: Fused Silica, Glass, Zerodur
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Cerium Oxide | 1.150 | 9.7 | 15.0% | 1.14 |
Ultra-Sol® 1000HP
High Purity Cerium Oxide Suspension
Ultra-Sol 1000HP is an extremely high purity, stable, precision cerium oxide polishing slurry used extensively for achieving sub-angstrom optical finishes on silica-based optical materials. Polishing performance meets or exceeds industry specifications for sleek, scratch/dig, and...
Applications: Fused Silica, Glass, Zerodur
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Cerium Oxide | 0.950 | 8.5 | 10.2% | 1.05 |
Ultra-Sol® 100Z
Acidic Zirconium Oxide Slurry
Ultra-Sol 100Z is an acidic high-purity zirconium oxidedispersion with proprietary additives for achieving sub-angstrom finishes on optical materials. The synergy between high-purity zirconium oxideand the unique proprietary additives in Ultra-Sol 100Z provides excellent removal rates...
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Zirconium | 1.950 | 3.7 | 20.3% | 1.15 |
Ultra-Sol® 1040
High Purity Cerium Oxide Suspension
Ultra-Sol 1040 is a dispersion used extensively in precision polishing of glass, quartz, fused silica, and other silica-based optical materials. It is similar to the Ultra-Sol 1000, but with significantly higher concentration. The alkaline...
Applications: Fused Silica, Glass
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Cerium Oxide | 1.150 | 9.2 | 40.6% | 1.53 |
Ultra-Sol® 200A
Advanced Particle Slurry
Ultra-Sol 200A is a unique colloidal alumina slurry with proven results in polishing a wide variety of materials. Being an industry standard slurry for over fifteen years, 200A continues to be the process of record...
Applications: Aluminum, Cadmium Zinc Telluride, Gallium Arsenide, Indium Phosphide, Nickel, Spinel, Zinc Selenide
| Base Material | Particle Size (um) | pH | Solids Content | Specific Gravity |
| Aluminum Oxide | 0.100 | 4.0 | 20.0% | 1.14 |