Category - Polishing Pads

Dow® IC1000™ Polishing Pads

The Industry Standard for Chemical Mechanical Planarization

IC1000™ pad is the industry-standard polishing pad for chemical mechanical planarization (CMP). The IC1000 pad is made of a rigid, micro-porous polyurethane material. These properties enable the IC1000 pad to deliver localized planarization, excellent removal...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane2.25 %57Shore D50
Category - Polishing Pads

Dow® IC1010™ Chemical Mechanical Polishing Pads

The Industry Standard for Chemical Mechanical Planarization

The IC1010™ polishing pad is designed for optimal chemical mechanical planarization (CMP) performance on the Applied Materials Mirra and Reflexion polisher platforms. The IC1010 pad is a rigid microporous polyurethane pad with a proprietary radial...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane2.25 %57Shore D80
Category - Polishing Pads

Dow® IC1010™ Chemical Mechanical Polishing Pads with Window

The Industry Standard for Chemical Mechanical Planarization

The IC1010™ polishing pad is designed for optimal chemical mechanical planarization (CMP) performance on the Applied Materials Mirra and Reflexion polisher platforms. The IC1010 pad is a rigid microporous polyurethane pad with a proprietary radial...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane2.25 %57Shore D80
Category - Polishing Pads

EXTERION(TM)

Exterion polishing pads

EXTERION pads are an advanced urethane with ceria filler, specifically formulated to meet the needs of different glass and optical polishing applications. The unique and controlled pore structure differenciate them from competitor pads in both performance...

Applications: Acryllic, Aluminosilicate, APEX, BK7, BK9, Borofloat, Borosilicate, Ceramic, Crystal Quartz, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Gorrilla, Leaded Crystal, Phosphate, Pyrex, SF6 Flint, Soda Lime - Float, Zinc Borosilicate

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane3 %86JIS50
Category - Polishing Pads

IC OPTIC

IC Optic

Next generation optical surfaces will be manufactured in rigorous, predictive, process-controlled environments.   Recognizing that your polishing consumables require that same consistency, Eminess is pleased to offer IC OPTIC.  Made from the same controlled variation-free material...

Applications: Aluminosilicate, APEX, Berylium, BK7, BK9, Borofloat, Borosilicate, Ceramic, Cleartran - Zn Su Multi-spectral, Crystal Quartz, Fused, Fused Silica, Germanium, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Gorrilla, Leaded Crystal, Phosphate, Poly Carbonate lens, Pyrex, Quartz, SF6 Flint, Soda Lime - Float, Zerodur, Zinc, Zinc Borosilicate, Zinc Selenide, Zinc Sulfide

Base Material
Urethane
Category - Polishing Fixtures

IPTA3

Waxless Fixturing for High Volume Production

Rohm and Haas Electronic Materials originally pioneered the development of waxless mounting systems for the semi-conductor market by inventing standard template assemblies and insert process template assemblies. Eminess acquired the technology and has expanded the...

Applications: Silicon

Base MaterialPocket Depth Range
Urethane0.004 - 0.050
Category - Polishing Pads

MHN15A020

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane3.05 %84JIS20
Category - Polishing Pads

MHN15A039

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane3.05 %84JIS39
Category - Polishing Pads

MHN15A050

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane3.05 %84JIS50
Category - Polishing Pads

MHS15A050

Advanced Polyurethane Pads for the Silicon Market

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base MaterialCompressibilityHardnessHardness TestThickness
Urethane3.05 %84JIS50