Valtron® AD1339-A / AD3939-B
Increased Hardness Ingot Mounting Epoxy System
Valtron® AD1339-A / AD3939-B Details
Valtron® adhesive resins and hardeners are available in a variety of packaging configurations, including: 5-Gallon Pails, 4x1 Gallon Cases, 1-Gallon Containers, 1-Pint Cans, and pre-measured syringes.
|Valtron® AD1210-A / AD1769-B||Valtron® AD1230-A / AD1210-B||Valtron® AD1339-A / AD3939-B||Valtron® AD1238-A / AD3848-BR||Valtron® AD1339-A / AD3905-B|
|Bond Strength 4 hrs (psi)||500||1||2||1|
|Bond Strength 8 hrs (psi)||1||1||1||2||2|
|Cure Time (hrs)||6||5||2||2||4|
|Gel Time (min)||50||15||5||30|
|Glass Transition Temp (.C)||40||40||35||40|
|Hardness (Shore "D")||77||82||85||84||85|
|Mixing Ratio (by volume)||100||10||1||1||1|
|Moveable Time (min)||240||60||30||60|
The Valtron® adhesive is a two-component system for mounting semiconductor and photovoltaic ingots. Mixing ratios are by weight, and must be observed to achieve best results. The hardener is pigmented to indicate when a thorough mix has been obtained for the two adhesive components. It is important that all surfaces be thoroughly cleaned prior to applying the adhesive. A thin, uniform layer of adhesive results in optimum performance.
Conventional epoxy removal methods will demount sliced wafers mounted with the Valtron® Ingot Mounting Adhesives. The Valtron® Ingot Mounting Adhesive can be used in conjunction with the Valtron® AD8000 Ingot Mounting Primer to eliminate the need for hazardous demounting solutions. Ingots mounted with the Valtron® AD8000 Ingot Primer Coat and the Valtron® Ingot Mounting Adhesive can be removed with the Valtron® high pH formulated alkaline detergents.
The optimal application temperature for VALTRON epoxy adhesives is 77°F±3 degrees (25°C) after receiving the package. Temperature is important because the adhesive layer may be too thin at higher temperatures, or too thick to mix and spread at lower temperatures. It may also be difficult to release the entrapped air from applied adhesive layer at lower temperatures. The area where the bonding of the silicon ingot to the slicing beam process will take place should be maintained at 68-77°F (20-25°C) with a relative humidity of 60% or below.
Dispose of in accordance with all applicable local regulations.