Valtron® AD1238-A / AD3848-BR

Fast Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes. These patented two-component quick-curing adhesive systems are made with unique components and performance characteristics to maximize production throughput and reduce the amount of stress occurring between the crystalline material and the adhesive. This reduction in stress results in a decrease in the amount of edge chips that occur during slicing. VALTRON adhesives prevent loading onto the annular saw and will eliminate saw marks, increase saw blade life, and improve slicing yields. Easy removal of the epoxy from the wafers with a VALTRON heated detergent solution eliminates the need for aggressive acids, caustics, and solvents. VALTRON adhesives are color pigmented to easily indicate when a complete mix of resin and hardener is achieved, and provide fast cure times at room temperature.

Valtron® AD1238-A / AD3848-BR Details

Base Material:


Shelf Life:

12 Months


Valtron® adhesive resins and hardeners are available in a variety of packaging configurations, including: 5-Gallon Pails, 4x1 Gallon Cases, 1-Gallon Containers, 1-Pint Cans, and pre-measured syringes.

Similar Products

Valtron® AD1210-A / AD1769-BValtron® AD1230-A / AD1210-BValtron® AD1339-A / AD3939-BValtron® AD1339-A / AD3905-B
Base Material EpoxyEpoxyEpoxyEpoxy
Bond Strength 4 hrs (psi)50011
Bond Strength 8 hrs (psi)1112
Cure Time (hrs)6524
Density (g/cc)
Gel Time (min)501530
Glass Transition Temp (.C)404040
Hardness (Shore "D")77828585
Mixing Ratio (by volume)1001011
Moveable Time (min)2406060
Viscosity (cps)650003500011500043000
Category - Wafering Adhesives

Handling Instructions

The Valtron® adhesive is a two-component system for mounting semiconductor and photovoltaic ingots. Mixing ratios are by weight, and must be observed to achieve best results. The hardener is pigmented to indicate when a thorough mix has been obtained for the two adhesive components. It is important that all surfaces be thoroughly cleaned prior to applying the adhesive. A thin, uniform layer of adhesive results in optimum performance.

Conventional epoxy removal methods will demount sliced wafers mounted with the Valtron® Ingot Mounting Adhesives. The Valtron® Ingot Mounting Adhesive can be used in conjunction with the Valtron® AD8000 Ingot Mounting Primer to eliminate the need for hazardous demounting solutions. Ingots mounted with the Valtron® AD8000 Ingot Primer Coat and the Valtron® Ingot Mounting Adhesive can be removed with the Valtron® high pH formulated alkaline detergents.


The optimal application temperature for VALTRON epoxy adhesives is 77°F±3 degrees (25°C) after receiving the package. Temperature is important because the adhesive layer may be too thin at higher temperatures, or too thick to mix and spread at lower temperatures. It may also be difficult to release the entrapped air from applied adhesive layer at lower temperatures. The area where the bonding of the silicon ingot to the slicing beam process will take place should be maintained at 68-77°F (20-25°C) with a relative humidity of 60% or below.


Dispose of in accordance with all applicable local regulations.

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