Tensor HTD-2

Coolant/Lubricant for Enhanced Dicing or Back-Grinding

As Back-End IC processing and packaging becomes more integral to the performance of electronic devices, optimization of legacy back-end processes becomes critical. Intersurface Dynamics historically has helped to extend an array of legacy processes for use in the production of these more value added parts through the development of complex chemistry that solves process and material issues. Different more complex wafers/die/packaging design and materials can be more easily processed with defect reduction and yield improvement through the simple integration of one of the three TENSOR HTD Series Products. TENSOR HTD-2 is a specially formulated chemical product performing as a combination coolant/lubricant/corrosion inhibitor for dicing/back-grinding semiconductor devices and packaging. Alternative variations exist as well to enable a precise match to different process requirements and parameters. Benefits: • Simplify/eliminate post-process cleaning by reducing saw dust/debris from the wafer/die/package surface. • Reduce IC defects caused by chipping during dicing. • Reduce de-lamination through package stress reduction during dicing. • Reduce bonding defects caused by metal oxide formation on bond pad surfaces by eliminating corrosion/oxidation of exposed metals during dicing/back-grinding • Extend saw blade/grinding wheel life by keeping the bond/diamond matrix clean. • Increase grind uniformity and reduce surface roughness of wafers TSV/TWV by allowing uniform and proper wear of the grinding wheel. • Eliminate electrical defects through prevention of galvanic corrosion.

Tensor HTD-2 Details

Base Material:


Shelf Life:

24 Months


Product is available in 5-gallon pails and 55-gallon drums.

Similar Products

Tensor HTD
Base Material Water
Specific Gravity
Category - Grinding and Slicing

Handling Instructions

Mix Tensor HTD-2 at a dilution between 200:1 and 500:1 in the saw/grind water using an injection pump. Ensure enough of the mixture floods the interface of the blade/wheel wafer/package interface.


Product should be stored in a temperature controlled environment. Prolonged exposure to temperatures at or below 32° Fahrenheit (0°C) is discouraged. Prolonged exposure to temperatures at or above 100° Fahrenheit (38°C) is also discouraged. In addition, material should always be sealed when not in use to prevent evaporation.


Dispose of in accordance with all applicable local regulations.

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