Tensor D Rinse

Additive for High Pressure Pad Rinse & Wafer De-Chucking Cycles

Tensor D-Rinse is a specially formulated additive designed for use in high-pressure pad rinse and wafer de-chucking systems of today’s CMP tools. When added to the rinse water at concentrations between 10% and 25% Tensor D-Rinse will reduce light scratching produced during the high-pressure rinse/de-chucking cycle. Tensor D-Rinse will also facilitate removal of slurry chemistry, particles and pad residues, thus increasing the effectiveness of post-CMP (megasonic and brush) wafer cleaning processes. Tensor D-Rinse is formulated to eliminate corrosion/oxidation of metals that can occur during wafer transport to 2nd and 3rd phases as well as delayed transport to the cleaning station. Benefits: • Superior wetting with low foam • Free rinsing – leaves no films or residue • Cleans residues left by any commercially available CMP slurries • Fully compatible with advanced metal schemes and associated dielectrics • Fully compatible with all industry standard CMP tools and pad rinsing/wafer dechucking systems • Easily implemented • Safe and economical to use

Tensor D Rinse Details

Base Material:


Shelf Life:

24 Months


Product is available in 5-gallon pails and 55-gallon drums.

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Handling Instructions

It is recommended that Tensor D-Rinse be added to the high-pressure water rinse line at 10% to 25%. The types of post-CMP residues, length of time under the spray, spray pressure, slurry chemistry and other process factors ultimately determine specific dilutions and methods of use.


Product should be stored in a temperature controlled environment. Prolonged exposure to temperatures at or below 32° Fahrenheit (0°C) is discouraged. Prolonged exposure to temperatures at or above 100° Fahrenheit (38°C) is also discouraged. In addition, material should always be sealed when not in use to prevent evaporation.


Dispose of in accordance with all applicable local regulations.

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