Waxless Fixturing for High Volume Production

Rohm and Haas Electronic Materials originally pioneered the development of waxless mounting systems for the semi-conductor market by inventing standard template assemblies and insert process template assemblies. Eminess acquired the technology and has expanded the product line by offering a variety different backing films, such as the DF200, E208, E303, E310, WB20, and CHOIS. Our template assemblies provide excellent flatness with-out using mounting wax. Standard template assemblies are composed of a backing material on which the wafer rests and the template which holds the wafer in place, thus providing a rigid support structure around the wafers during polishing. General Waxless Fixturing Benefits: Easy Application – pressure sensitive adhesive on template assemblies allows easy application to carrier plates. Easy Removal – wafers are easily removed with a water pick or in a water bath after polishing. No De-Waxing Clean Step Required – no chemicals are used to hold wafers. No CFCs – template assemblies are environmentally friendly and non-hazardous. Specific IPTA3 Benefits: Greater Economy – the more durable portion of the fixture, the template itself, need not be replaced when the insert material is worn or fatigued. Greater Efficiency – less operator time and effort are needed to replace an insert than to change a complete NTA.

IPTA3 Details

Base Material:


Shelf Life:

12 Months


Fixtures are packaged face-to-face (polish side to polish side) and sealed inside a plastic bag to ensure cleanliness during transportation. The bags are taped to the side of the box to prevent the bag from slipping and damaging the pads. Fixtures should always remain flat. Bending fixtures during handling can cause wrinkles in the PSA and premature delamination of the release liner.



Similar Products

Base Material Fiberglass
Pocket Depth Range0.004

Complementary Products

  • Inserts

    DF200 Disks for use in IPTA Technology

Category - Polishing Fixtures

Handling Instructions

Only apply to a clean, dry surface at room temperature. If an appropriate solvent, such a isopropyl alcohol, is used to clean the carrier plate after an IPTA removal, allow the carrier plate to dry completely and return to room temperature before applying the IPTA. Solvents remaining on the carrier plate or an unusually cold carrier plate will lower PSA adhesion.

When applying the IPTA to the carrier plate, peel the release liner from one edge of the IPTA. Fold liner back approximately 2 inches. Align the IPTA with the edge of the carrier plate and adhere. In one continuous movement, slowly peel the remaining release liner off the IPTA while pressing the IPTA down on the carrier plate. The application should be smooth and uniform with even pressure from the pad mounting tool (such as a flat disk or hand roller).

Do not try to reposition IPTAs with PSA II adhesive.


Product should be stored and transported in the original packaging. The product should be stored in temperatures between 10°C to 24°C (50°F to 75°F) and <50% humidity. Exposure for six (6) months or less to conditions between -17°C to 48°C (0°F and 120°F) and/or at relative humidity of up to 100% will not impact the product performance as long as the release liner remains intact and attached to the PSA. If the product is exposed to temperatures and humidity outside the recommended conditions, it may still be acceptable for use. In all cases, the product should be allowed to return to normal room temperatures prior to use.


Dispose of in accordance with all applicable local regulations.

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