Dow® IC1010™ Chemical Mechanical Polishing Pads

The Industry Standard for Chemical Mechanical Planarization

The IC1010™ polishing pad is designed for optimal chemical mechanical planarization (CMP) performance on the Applied Materials Mirra and Reflexion polisher platforms. The IC1010 pad is a rigid microporous polyurethane pad with a proprietary radial grooving pattern designed for longer lifetime relative to a standard IC1000™ pad. Like the IC1000 pad, the IC1010 pad offers excellent planarization capability, consistent removal rates, low global non-uniformity, and good defectivity. The longer lifetime of the IC1010 results in less frequent CMP tool downtime for pad changes, improving cost of ownership. Product Configuration Thickness The standard thickness for an IC1010 pad is 80 mils. Optical Endpoint Window IC1010 pads are offered with a transparent urethane window to enable the optical endpoint technology in leading edge CMP tools. Advanced optical endpoint pads feature a window that is bonded to the IC1000 pad to prevent slurry leakage and window delamination in all CMP processes. Diameter IC1010 pad is offered in 20” and 30” diameters, for 200mm and 300mm CMP tools respectively. Subpads A compressible subpad improves the global non-uniformity performance of IC1010 pad. These pads are offered with a variety of subpads depending on the performance needs of the process. Suba™ IV subpad is the industry standard subpad. SP2000 subpads are the next generation of subpads, which offer improvements in reliability and performance.

Dow® IC1010™ Chemical Mechanical Polishing Pads Details

Base Material:

Urethane

Shelf Life:

12 Months

Packaging:

Pads are packaged face-to-face (polish side to polish side) and sealed inside a plastic bag to ensure cleanliness during transportation. The bags are taped to the side of the box to prevent the bag from slipping and damaging the pads. Pads should always remain flat. Bending pads during handling can cause wrinkles in the PSA and premature delamination of the release liner.

Applications:

Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Similar Products

Dow® IC1000™ Polishing PadsDow® IC1010™ Chemical Mechanical Polishing Pads with Window
Base Material UrethaneUrethane
Compressibility2.252.25
Hardness5757
Hardness Test00
Thickness5080

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Category - Polishing Pads

Handling Instructions

Apply only to a clean, dry surface at room temperature. If an appropriate solvent, such as isopropyl alcohol, is used to clean the platen after a pad removal, allow the platen to dry completely and return to room temperature before applying a new pad. Solvents remaining on the platen or an unusually cold platen will lower PSA adhesion.

When applying the pad to the platen, peel the release liner from one edge of the pad. Fold liner back approximately 2 inches. Align the pad with the edge of the platen and adhere. In one continuous movement, slowly peel the remaining release liner off the pad while pressing the pad down on the platen. The application should be smooth and uniform with even pressure from the pad mounting tool (such as a flat disk or hand roller).

Do not try to reposition pads with PSA adhesive

Storage

Product should be stored and transported in the original packaging. The product should be stored in temperatures between 10°C to 24°C (50°F to 75°F) and <50% humidity. Exposure for six (6) months or less to conditions between -17°C to 48°C (0°F and 120°F) and/or at relative humidity of up to 100% will not impact the product performance as long as the release liner remains intact and attached to the PSA. If the product is exposed to temperatures and humidity outside the recommended conditions, it may still be acceptable for use. In all cases, the product should be allowed to return to normal room temperatures prior to use.

Disposal

Dispose of in accordance with all applicable local regulations.

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