Rohm and Haas Electronic Materials Slurries

• MSW2000:  a metal polish slurry designed primarily for tungsten CMP polishing. Click here for more info.
  
  
• MSW1500:  a low sodium metal polish slurry designed primarily for tungsten CMP processing. Click here for more info.
  
  
• EPL2361:   a single component colloidal silica based Copper CMP slurry for bulk copper removal and planarization at moderate polish pressure. Click here for more info.
  
  
• EPL8105:   is a cleaning solution that eliminates the buildup of copper oxides on polish pads during copper CMP and is also very effective at removing the passivation layer that forms on copper wafer surfaces. Click here for more info.
  
  
• CUS1300:   the CUS1300 family consists of a pair of slurries for barrier removal during the copper CMP process. Click here for more info.

Klebosol® Slurries

• Klebosol® Slurries:   Most widely used colloidal silica products for CMP. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry expectations with competitive results. Click here for more info.

   

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