Category - Wafering Adhesives

Valtron® AD1210-A / AD1769-B

Slow Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 8 hrs (psi) Cure Time (hrs) Mixing Ratio (by volume) Viscosity (cps) Color
Epoxy 77 1.21 1,700 6 100 65000 Gray/Red
Category - Wafering Adhesives

Valtron® AD1230-A / AD1210-B

Water Resistant Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Moveable Time (min) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color Glass Transition Temp (C)
Epoxy 82 1.21 500 1,700 240 5 50 10 35000 Gray/Green 40
Category - Wafering Adhesives

Valtron® AD1238-A / AD3848-BR

Fast Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Moveable Time (min) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color Glass Transition Temp (C)
Epoxy 84 1.21 2,200 2,700 30 2 5 1 70000 Gray/Red 35
Category - Wafering Adhesives

Valtron® AD1339-A / AD3905-B

Increased Hardness and Gel Time Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Moveable Time (min) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color Glass Transition Temp (C)
Epoxy 85 1.47 1,800 2,000 60 4 30 1 43000 White/Purple 40
Category - Wafering Adhesives

Valtron® AD1339-A / AD3939-B

Increased Hardness Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Moveable Time (min) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color Glass Transition Temp (C)
Epoxy 85 1.65 1,800 1,800 60 2 15 1 115000 White/Blue 40
Category - Wafering Adhesives

Valtron® AD4010-A / AD4015-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Bond Strength 24 hrs (psi) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color
Epoxy 74 1.14 1,100 1,600 2,100 2 4 1 11500 White/Yellow
Category - Wafering Adhesives

Valtron® AD4010-A / AD4017-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base Material Hardness (Shore “D”) Density (g/cc) Bond Strength 4 hrs (psi) Bond Strength 8 hrs (psi) Bond Strength 24 hrs (psi) Cure Time (hrs) Gel Time (min) Mixing Ratio (by volume) Viscosity (cps) Color
Epoxy 74 1.03 350 380 2,100 2 7 2 275000 White/Yellow