Category - Polishing Slurries

Dow ACuPLANE LK393c4

Copper Barrier Slurry

The LK393c4 Copper Barrier slurry, the latest addition to the LK Series, is an alkaline mixture of ultra-pure water, colloidal silica, and proprietary additives that enable its robust process performance. With a 1:1 selectivity of copper;…

Base Material Particle Size (µm) pH Solids Content
Colloidal Silica 0.050 10.4 12
Category - Polishing Slurries

Dow® Celexis™ CX94S

High-Purity Nano Cerium Slurry for STI

The Celexis Series of Shallow Trench Isolation (STI) slurries is a ceria-based high selectivity system which provides silica-like defectivity with excellent planarization expected of direct STI processes. Developed around mask layouts with a wide range of…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Cerium Oxide 0.130 6.2 1.8% 1.02
Category - Polishing Slurries

Dow® CUS1351

Copper Barrier Slurry

The CUS1351 barrier slurry for copper CMP was designed to improve upon the dishing and erosion results obtained after first step polishing while removing any residual copper present after the first step polishing process. CUS1351 provides…

Base Material pH Solids Content
Colloidal Silica 8.9 12.4%
Category - Polishing Slurries

Dow® Klebosol™ 1501-50

Industry standard CMP colloidal silica for ILD and STI

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing.  These particles are grown and maintain excellent stability in their liquid medium.  Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.050 10.9 30.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 1508-50

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.050 10.9 30.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 1630/16

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.120 10.7 16.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 1630/26

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.120 10.7 26.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 30H50

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Applications: Tungsten

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.050 2.0 30.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 30N50

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.050 10.0 30.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 30N50PHN

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.050 10.9 30.0% 1.21
Category - Polishing Slurries

Dow® Klebosol™ 40PA50

Industry Standard Colloidal Silica Slurries for CMP

Klebosol slurry products are the most widely used colloidal silica products for CMP polishing. These particles are grown and maintain excellent stability in their liquid medium. Klebosol slurries have been shown to meet or exceed industry…

Base Material Particle Size (µm) Specific Gravity
Colloidal Silica 0.050 1.30
Category - Polishing Slurries

Nalco™ 2329

Colloidal Silica Dioxide

NALCO 2329is a colloidal dispersion of submicron-sized silica particles in the form of tiny spheres, in an alkaline aqueous solution. NALCO 2329has a negative surface charge and is ammonium stabilized. Primary Benefits High silica concentrationOptical clarity…

Base Material Particle Size (µm) pH Solids Content Specific Gravity
Colloidal Silica 0.075 8.4 40.0% 1.29