Category - ID Slicing Blades

Mark III ID Blade

High Quality Blades for Precision Wafering

Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials.Only the finest 100% natural virgin DeBeers diamonds are used to minimize…

Applications: Silicon

Category - ID Slicing Blades

Mark V ID Blade

High Quality Blades for Precision Wafering

Semiconductor Materials, Inc (SMI) patented multi-layered diamond ID slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials.Only the finest 100% natural virgin DeBeers diamonds are used to minimize…

Applications: Ceramic, Sapphire