Conditioners

Conditioners

Products designed to improve the performance and lifetime of other consumables used in polishing, grinding, or cutting.

Edge Grinding

Edge Grinding

Stainless steel wheels manufactured with 100% natural diamonds electronically nickel-plated.

Grinding and Slicing

Grinding and Slicing

Synthetic formulations designed to optimize removal rate and surface finish in grinding, sawing, and dicing processes.

ID Slicing Blades

ID Slicing Blades

Inside diameter blades manufactured with 100% natural diamonds for precision wafering of materials such as quartz, samarium cobalt, ceramics, and sapphire.

Lapping Additives

Lapping Additives

Polymer based formulations designed to improve the performance of non-suspension treated abrasives.

Molded Products

Molded Products

Custom molded polymers include ingot slicing beams, dicing blocks, and ingot support beams. Frequently required for mounting materials prior to ID and wire saw wafering.

Polishing Fixtures

Polishing Fixtures

Disposable fiberglass templates which eliminate the need to wax mount wafers and manufactured with a wide variety of backing films to meet any customer requirement.

Polishing Pads

Polishing Pads

Dow® polishing pads distributed and/or customized by Eminess for unique markets including optics, semiconductor, storage media, and specialty materials.

Polishing Slurries

Polishing Slurries

Unique blends of abrasive materials with advanced chemistries built on particles such as colloidal silica, aluminum oxide, diamond, and cerium oxide.

Rinsing and Cleaning

Rinsing and Cleaning

Economical formulations used to store, clean or rinse wafers either between or after lapping and polishing.

Sonic Cleaning

Sonic Cleaning

Water-based detergents designed to optimize megasonic and ultrasonic cleaning.

Wafering Adhesives

Wafering Adhesives

Two-component quick-curing epoxy products with industry leading cure times, commonly used in photovoltaic and semiconductor wafer processing.