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NEW PRODUCTS - EMINESS SPECIALTY SUBSTRATE SLURRIES
- Ultra Sol™ A-15 First Step Bulk Metal Removal Slurry
- Colloidal Alumina
- First step bulk removal of Cu stop on barrier layer.
- Stock removal slurry for Cu, NiCoFe alloys, and other metals
- Suppresses grain highlighting
- Reduced or no pitting or corrosion
- Controllable Removal Rate (RR) on Ta, TaN, Cu, and SiO2
- Specifications
- Functional Particle Size: 0.2µ (microns)
- Percent Solids: 14.5%-16% (wt%)
- pH at 20-25C: 5.40 - 5.80
- Ultra Sol™ S-13 Copper Barrier Cleaning Slurry
- Colloidal Silica
- Following first step bulk removal of Cu stop on barrier layer. Possible use as a first step polish through longer polish times and/or increase in oxidizer.
- 2nd Step Copper (Cu) on Tantalum (Ta) or Tantalum Nitride (TaN) and Silicon Dioxide (SiO2)
- Specifications
- Functional Particle Size: 0.07µ (microns)
- Percent Solids: 13.5%-16.5% (wt%)
- pH at 20-25C: 8.5 - 9.5
- Ultra Sol™ S-10 Polysilicon Thin Film Polish Slurry
- Colloidal Silica
- Polysilicon Thin Film Polish Slurry
- Very Smooth Surface Finish
- Reproduceable polishing results and easy to use
- No grain highlighting
- Works well in wide range of process conditions
- Specifications
- Functional Particle Size: 0.050µ (microns)
- Percent Solids: 30% (wt%)
- pH at 20-25C: 10
- Ultra Sol™ A-12 Polyimide Polish
- Colloidal Alumina
- Proven polish results on polyimide and may have polish applications on a range of crosslinked polymer films including baked photoresist and other materials beyond traditional semiconductor devices
- Precision Polymer Surface Finish with no scratching
- Reproduceable polishing results and easy to use
- Controllable removal rate and uniformity
- Good planarization
- Specifications
- Functional Particle Size: 0.2µ (microns)
- Percent Solids: 13.5%-16% (wt%)
- pH at 20-25C: 3.5-4.5
- Ultra Sol™ C-11 Oxide Selective Slurry
- Polishing oxide where the need to stop dead on polysilicon or single crystal silicon (Si) with no damage to the polysilicon or Si layer
- Microelectromechanical systems (MEMS)
- Optoelectronics
- Optical Coatings
- Excellent Surface Finish with no scratching or damage to polysilicon like other slurries
- Selectivity of 3:1 oxide to polysilicon. (Typical oxide slurries have 1:3 oxide to polysilicon)
- Excellent Removal Rate (RR)
- Specifications
- Functional Particle Size: 1.0µ (microns)
- Percent Solids: 14.5%-17.4% (wt%)
- pH at 20-25C: 8.5 - 10.4
- Ultra Sol™ SiC-14 Silicon Carbide (SiC) Neutral pH Slurry
- Polishing single crystal SiC or SiC thin films
- Excellent Surface Finish
- Excellent Removal Rate (RR) on carbon and silicon face off-axis
- Good RR on zero degree Si face on axis
- Specifications
- Functional Particle Size: 2.0µ (microns)
- Percent Solids: 13.5%-16% (wt%)
- pH at 20-25C: 7.0 - 8.5
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FOR CUSTOM REQUESTS, PRICING, OR ORDERING INFORMATION
CALL 1-888-899-1942
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