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+ Semi-Conductor Chemical Mechanical Planarization (CMP)
Interlayer Dielectric (ILD)
Shallow Trench Isolation (STI)
Tungsten
Copper
Polysilicon
Platinum
+ Specialty Substrate CMP Polishing
Nickel Iron NiFe
Nickel Iron Cobalt NiFeCo
Quartz SiO2
Sapphire Al2O3
Gallium Arsenide GaAs
Gallium Antimonide GaSb
Gallium Nitride GaN
Indium Phosphide InP
Indium Gallium Phosphide InGaP
Lithium Niobate LiNbO3
Lithium Tantalate LiTaO3
Aluminum Nitride AlN
Silicon Germanium SiG
Silicon Carbide SiC
Yttrium Aluminum Garnet YAG
+ Magneto-Resistive Device Polishing
Nickel Iron NiFe, Nickel Iron Cobalt NiFeCo
+ NEW Products
EMINESS Specialty Substrate Slurries
+ Ultra-Sol™ Slurries
Ultra-Sol™ Ceria Slurries
Ultra-Sol™ Silica Slurries
Ultra-Sol™ Zirconia Slurries
Ultra-Sol™ Alumina Slurries
Ultra-Sol™ Fiber Optics Slurries
Ultra-Sol™ Diamond Suspensions
+ Polishing Systems
Glass Polishing Systems
Optical Polishing: Colloidal Silica
Optical Polishing: Colloidal Alumina
Fiber Optic Polishing System
Specialty Slurries
Ultra-Lox™ Powders
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FUNCTIONAL PARTICLE SIZE DEFINITION

Functional Particle Size is the actual raw material size of the abrasive particles used in the manufacturine of our products. This is the particle size that will do the polishing. This size can differ from the particle sizes obtained in various particle size and distribution tests. In slurries, especially colloidal alumina slurries, the abrasive particles can agglomerate into larger particles and appear in particle size tests. (We use the Horiba LA-910 test to measure the particles in our slurry before shipment). When these slurries are used in processing, the force applied by the polishing process will break the agglomerate particles up into their functional particle sizes and it is these abrasive particles that will do the actual polishing.